The thermal shutdown circuitry in an IC prevents the junction temperature from rising high enough to damage the part (see Figure 7). This is accomplished by monitoring the die temperature and reducing internal power dissipation to hold the temperature at the limiting value (usually about 160°C).
It is possible for RO to be negative – an undesirable characteristic often caused by poor layout design in the regulator wiring resulting in inadvertent positive feedback. With negative output resistance the output voltage increases with the load current.
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